20+ YEARS OF EQUIPMENT SOFTWARE EXPERIENCE

Semiconductor Equipment
Software Engineering

Engineering software for advanced thin-film systems — from wafer handling and loadlocks to process chambers, equipment control, industrial communication and GEM/SECS factory automation.

Built in VietnamEngineering since 2003IBE · IBD · PVD · RIE · HRPVD
HYTEK
EQUIPMENT
CONTROL
LOADLOCK
PROCESS
MOTION
GEM / SECS
2003Engineering experience since
Multi-ChamberEquipment architecture experience
10+ ProtocolsIndustrial communication experience
GEM / SECSFactory automation integration
ABOUT HYTEK

We understand the equipment behind the software.

HYTEK SOLUTIONS VN COMPANY LIMITED is a Vietnam-based software engineering company specializing in semiconductor and advanced thin-film equipment.

Our engineering experience in this field dates back to 2003. We have developed and supported software across process chambers, wafer handling systems, loadlocks and integrated multi-chamber platforms.

Our work spans hardware integration, motion, vacuum, process control, recipes, HMI, alarms and interlocks, data logging, industrial communication, and GEM/SECS automation.

“Semiconductor equipment software requires more than general software development skills — engineers need to understand how software interacts with real equipment, processes and hardware.”
EQUIPMENT EXPERIENCE

From individual chambers to multi-chamber platforms.

Our experience covers the equipment control stack — from wafer handling and loadlocks to multiple process modules and factory automation.

MULTI-CHAMBER

High-Capacity Cluster Platform

2 Loadlocks, 4–6 Process Chambers, integrated wafer handling and multi-process control.

MULTI-CHAMBER

Mid-Capacity Cluster Platform

2 Loadlocks, 3 Process Chambers, with integrated handling and process control.

MULTI-CHAMBER

3-Chamber Integrated PVD System

1 Loadlock, 3 Process Chambers, with integrated PVD process control.

HANDLING

Single-Loadlock Wafer Handler

Integrated IBE / IBD.

HANDLING

Multi-Cassette Automated Loader

Integrated IBE / IBD.

ONE-PACKAGE SYSTEMS

Standalone Single-Package Systems

RIE & Integrated PVD.

Expanded Generic Names

Ion Beam Etching (IBE)Ion Beam Deposition (IBD)Physical Vapor Deposition (PVD)Advanced PVDMulti-Target PVDHigh-Rate PVD (HRPVD)Reactive Ion Etching (RIE)Inline PVD Systems
SOFTWARE ENGINEERING

The software layer that makes equipment work.

We work as an extension of equipment engineering teams, from low-level hardware integration through process control and automation.

01

Equipment Control

State management, sequencing, manual/automatic operation, configuration, diagnostics, alarms, interlocks and recovery.

02

Recipe & Process

Recipe creation and execution, parameter management, process sequencing, monitoring, run history and data logging.

03

Motion & Handling

Multi-axis motion, wafer handling, robot control, positioning, homing, rotation, lift and error recovery.

04

Hardware & I/O

PLC, motion controllers, digital/analog I/O, sensors, actuators, power supplies, MFCs, chillers and vacuum components.

05

Vacuum & Process

Cryogenic and turbo pumps, valves, pressure control, gas delivery, RF/DC power, plasma systems and process hardware.

06

HMI / GUI

Equipment HMI, configuration, recipe editors, process monitoring, alarm management, maintenance and diagnostics.

INDUSTRIAL COMMUNICATION

Connecting software to real equipment.

HYTEK engineers work across device-level communication, industrial interfaces and factory automation protocols.

↔

Hardware & Protocol Integration

Communication experience across equipment devices, controllers, process hardware and factory host systems.

From device communication to factory automation.
DEVICE & SERIAL

DeviceNet · COM · RS-232

Solenoid, RSTi, MFC and other equipment devices; SerialPort and direct serial communication.

NETWORK

TCP/IP Socket · ASCII / Raw

TCP/IP socket communication and custom ASCII/raw message protocols over TCP and COM.

INDUSTRIAL

OPC DA / Kepware

Industrial data exchange and equipment integration through OPC DA and Kepware environments.

MODBUS

TCP · RTU · ASCII

Modbus TCP, Modbus RTU over COM, Modbus RTU over TCP and Modbus ASCII over TCP.

SEMICONDUCTOR AUTOMATION

SECS/GEM · HSMS · SECS-II

Equipment communication and factory automation integration for semiconductor manufacturing environments.

FACTORY AUTOMATION

GEM / SECS integration

Modern semiconductor equipment must communicate reliably with factory host systems. HYTEK develops and integrates GEM/SECS functionality into equipment software.

  • SECS communication and HSMS
  • Equipment model and status variables
  • Alarms and collection events
  • Remote commands
  • Recipe management
  • Equipment and process data collection
FACTORY HOST
GEM / SECS · HSMS
EQUIPMENT CONTROLLER
MOTIONVACUUMPROCESS
ENGINEERING PARTNERSHIP

Your engineering team in Vietnam.

HYTEK supports equipment manufacturers and technology companies that need experienced software engineering capacity for semiconductor and thin-film equipment.

New Equipment Development

Software engineering for new equipment platforms from early development through production.

Existing Equipment Support

Maintenance, troubleshooting, enhancements and long-term support for deployed systems.

Dedicated Engineering Team

A focused Vietnam-based team working within your architecture and development process.

Legacy Software

Refactoring, modernization and feature development for existing equipment applications.

LET'S TALK

Build better equipment software together.

Tell us about your equipment, software architecture or engineering needs.

Semiconductor equipmentThin-film systemsIndustrial communicationGEM / SECS
HYTEK SOLUTIONS VN COMPANY LIMITEDEngineering Software for Advanced Thin Film Systemsdat.do@hytekvn.com.vnLầu 3, Số 5 Đống Đa, Phường Tân Sơn Hòa, Hồ Chí Minh, VietnamContact Our Engineering Team